◆Suitable for inspection of small-sized planar and highly reflective concave/convex features and surface flaws.
◆Coaxial optical path + 4-zone/8-zone + time-sharing stroboscopic illumination
◆Area-scan imaging compatibility, full-field acquisition in a single shot
◆Differentiating surface texture from genuine concave/convex defects
◆Suppressing shadow interference
◆High-precision synchronized stroboscopic control
◆ Silicon wafer surface inspection for scratches, pinholes, pits, edge chipping, particles, and oxide layer defects
◆ Chip surface inspection for dents, gold pad scratches, carrier micro-pits, and circuit protrusion/recess defects
◆ Ceramic substrate surface inspection for micro-holes, scratches, warpage, and chipping
◆ Glass surface inspection for micron-level scratches, pitting, edge chipping, contamination, and coating flaws
◆ Coating layer pinhole, surface pit, and grinding mark defect identification
◆ Micro-indentations and concave/convex defects on glass substrates and metal electrode surfaces
◆ Polished flat surfaces of stainless steel and aluminum alloy, identifying fine scratches, dents, impact marks, and concave/convex defects on brushed surfaces (normal brushing texture can be filtered out)
◆ PCB gold finger scratches, copper surface pits, protrusions, pinholes, and dent defects
| Model | Light-emitting surface size | Zone | Color |
|---|---|---|---|
| HS-2.5DCO-100-100 | 100mm*100mm | 4/8 | R/G/B/W/IR |
| HS-2.5DCO-150-150 | 150mm*150mm | 4/8 | R/G/B/W/IR |
| HS-2.5DCO-200-200 | 200mm*200mm | 4/8 | R/G/B/W/IR |
| HS-2.5DCO-250-250 | 250mm*250mm | 4/8 | R/G/B/W/IR |
| HS-2.5DCO-300-300 | 300mm*300mm | 4/8 | R/G/B/W/IR |
| HS-2.5DCO-350-350 | 350mm*350mm | 4/8 | R/G/B/W/IR |
